Open Interconnect Consortium Names Board Leadership and New Member Companies2021-06-02

Open Interconnect Consortium Names Board Leadership and 27 New Member Companies


Industry leaders from a broad range of markets join together to connect the Internet of Things

PORTLAND, Ore., Oct. 2, 2014 — The Open Interconnect Consortium, Inc. (OIC) today announced the appointment of its board of directors and 27 new member companies for a total of 32 members. With a focus on openness and participation, industry leaders from Cisco Systems Inc., Intel Corporation, MediaTek and Samsung Electronics Co., Ltd. are working together to define the connectivity requirements to improve interoperability between the billions of devices making up the Internet of Things (IoT).

Since Atmel, Dell, Intel, Samsung Electronics and Wind River founded the OIC in July, 27 new member companies have committed to establishing a standard with clear licensing terms to address current IoT challenges. New member companies include Acer, ActnerLab, Allion, Aepona, Cisco, Cryptosoft Ltd, Eyeball Networks, Global Channel Resource, Gluu, IIOT Foundation, InFocus, Laplink Software, Mashery, McAfee, MediaTek, Metago, NewAer, Nitero, OSS Nokalva Inc., Realtek Semiconductor Corp., Remo Software, Roost, SmartThings, Samsung Electro-Mechanics, Thug Design, VMC and Zula.

The OIC board of directors is drawn from companies that span a broad range of industry vertical segments including smart home and office solutions, consumer appliances and devices, telecommunications, enterprise technology and more. This diverse technology leadership will help ensure OIC specifications and open source implementations foster product designs that intelligently, reliably and securely manage and exchange information regardless of form factor, operating system or service provider.

“We are following a proven path of innovation with the OIC, by encouraging industry-wide collaboration, and our board members represent our commitment to provide a standard across a broad range of market sectors facing challenges from emerging IoT technology trends,” said Jong-Deok Choi, executive vice president and deputy head of Software R&D Center, Samsung Electronics and OIC president. “Our leadership and growing membership will create a single standard to solve connectivity and interoperability challenges in order to support the billions of connected devices coming online.”

Open Interconnect Consortium’s board of directors includes:

  • President: Jong-Deok Choi, executive vice president and deputy head of Software R&D Center, Samsung Electronics
  • Vice President: Imad Sousou, vice president, Software and Services Group and general manager, Intel Open Source Technology Center, Intel Corporation
  • Secretary: Bernard Shung, general manager, new business development, MediaTek
  • Treasurer: Kip Compton, vice president, IoT Systems and Software Group, Cisco

For more information, visit and follow the OIC on Twitter, @ointerconnect

About Open Interconnect Consortium
The Open Interconnect Consortium, a Delaware non-profit corporation, is being founded by leading technology companies with the goal of defining the connectivity requirements and ensuring interoperability of the billions of devices that will make up the emerging Internet of Things (IoT). To learn more, visit or email

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